High thermal conductivity, controlled volatility material maximizes heat dissipation and alleviates outgassing concerns


Henkel liquid thermal gap filler accelerates dispensing, reduces contamination risk and improves reliability.

Recognizing the requirement in many market sectors for thermal interface materials (TIMs) that can enhance processability while complying with increasingly challenging performance and cost metrics, Henkel has leveraged a new formulation approach in the development of Bergquist Gap Filler TGF 4500CVO. The liquid, gap filling thermal interface material dramatically improves on conventional TIM dispensing speeds, while simultaneously delivering high thermal conductivity of 4.5 W/m-K in a controlled volatility product.